Joints of carbon fiber-reinforced SiC composites to Ti-alloy brazed by Ag-Cu-Ti short carbon fibers

Joints of carbon fiber-reinforced SiC composites to Ti-alloy brazed by Ag-Cu-Ti short carbon fibers
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DOI:
10.1016/j.jmatprotec.2007.01.031
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发表时间:
2007-07-06
影响因子:
6.3
通讯作者:
Zhang, Hong
Zhang, Hong
中科院分区:
材料科学1区
文献类型:
--
作者:
Lin, Guobiao;Huang, Jihua;Zhang, Hong

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采用银-铜-钛短碳纤维作为钎料,连接碳纤维增强碳化硅复合材料和钛合金。研究了短碳纤维含量、钎焊温度和保温时间对接头剪切强度和显微组织的影响。纤维均匀分布在预制接头的钎焊层中,并优先取向在与钛合金或复合材料的钎焊面平行的平面上。纤维与钎焊层中的钛发生反应,在纤维本身上形成TiCx薄层,在钎焊层中形成TiCx小颗粒。当钎焊温度较低,保温时间较短时,如950℃×5min,由于碳纤维的作用,短碳纤维的加入降低了钎焊层与复合材料的界面结合强度。较高的钎焊温度和较长的保温时间,如950摄氏度x 15分钟,会导致钎焊层出现气孔。只有在最佳的钎焊温度和时间下,短切碳纤维含量适中时,接头的剪切强度才能达到最大,比纯Ag-Cu-Ti焊接头的最大剪切强度高30%以上,这是由于接头热应力的降低和碳纤维的增强作用所致。(C)2007年,爱思唯尔出版。
Ag-Cu-Ti short carbon fibers were used as brazing material to join carbon fiber-reinforced SiC composite and Ti-alloy. The effects of the content of short carbon fibers, brazing temperature and holding time on the shear strength and microstructure of the brazed joints were investigated. The fibers uniformly distribute in the brazing layer of the performed joint and are preferentially oriented in the plane parallel to the brazed surface of the Ti-alloy or the composite. The fibers react with Ti in the brazing layers, forming TiCx thin layers on the fibers themselves and TiCx small particles in the brazing layer. When the brazing temperature is low and the holding time is short, such as 950 degrees C x 5 min, the addition of short carbon fibers lowers interfacial bonding strength between brazing layer and composite due to the reaction of the carbon fibers. High brazing temperature and long holding time, such as 950 degrees C x 15 min, bring about pores in the brazing layer. Only the joint brazed at optimal brazing temperature and time and with suitable content of short carbon fibers has maximum shear strength, which is up to 30% higher than maximal strength for the case with pure Ag-Cu-Ti, due to the reduction of the joint thermal stress and the reinforcing effect provided by the carbon fibers. (c) 2007 Published by Elsevier B.V.