The growth of intermetallic compounds on common basis materials coated with tin and tin-lead alloys
The growth of intermetallic compounds on common basis materials coated with tin and tin-lead alloys
复制标题
镀有锡和锡铅合金的普通基础材料上金属间化合物的生长
DOI：
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发表时间：
1976
期刊：
影响因子：
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通讯作者：
C. MacKay
中科院分区：
文献类型：
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作者：
P. J. Kay;C. MacKay
本文是系列报告的第二篇，该系列报告了测定各种金属上锡和锡合金涂层在低于熔点温度下化合物生长速度的实验结果，以及由此形成的化合物对接头机械和物理性能的影响。本报告涉及硬铜和软铜、镍、银和黄铜作为基底，镀上锡和含锡60%、30%和10%的锡铅合金涂层，以及热浸60/40锡铅涂层，在各种受控温度和室温下储存。根据近5年的储存时间，实验确定了生长速率曲线。从阿伦尼乌斯图中可以计算出活化能，这些活化能可以估算出在所研究温度之间的任何温度下化合物的生长速率。对复合层进行了鉴定，结果表明铅不进入复合层，对于黄铜衬底，这两种化合物…
SummaryThis paper is the second in a series which reports the results of experiments to determine the rate of compound growth at temperatures below the melting point of tin and tin alloy coatings on various metals and the effect of compounds so formed on the mechanical and physical properties of joints. The present report deals with hard and soft copper, nickel, silver and brass as substrates plated with coatings of tin and tin-lead alloys containing 60%, 30% and 10% tin and also a hot dipped 60/40 tin-lead coating, stored at various controlled temperatures and at room temperature. Growth rate curves have been experimentally determined based on storage times up to nearly 5 years. Activation energies have been calculated from Arrhenius plots and these allow estimations of the rate of compound growth at any temperature intermediate between those studied. The compound layers have been identified and it is shown that lead does not enter into the compound layers and that for brass substrates the two compounds ...