Proposal and experimental demonstration of ultrathin-body (111) InAs-on-insulator nMOSFETs with L valley conduction
Proposal and experimental demonstration of ultrathin-body (111) InAs-on-insulator nMOSFETs with L valley conduction
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具有 L 谷导通的超薄体 (111) InAs 绝缘体 nMOSFET 的提案和实验演示
DOI:
10.1109/ted.2021.3049455
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发表时间:
2021
期刊:
影响因子:
--
通讯作者:
and S. Takagi
中科院分区:
文献类型:
--
作者:
K. Sumita;K. Toprasertpong;M. Takenaka;and S. Takagi
Ultrathin-body (UTB) (111) InAs-On-Insulator (InAs-OI) n-channel metal–oxide–semiconductor field-effect transistors (nMOSFETs) are proposed as a new technology booster using the L valley conduction in III–V channels. The performance of the conventional UTB III–V nMOSFETs is limited by the essential band features of thevalley conduction such as the low density of states, resulting in low inversion capacitance, and the light effective massalong the confinement direction, resulting in strong thickness fluctuation scattering. The strong confinement of electrons by a combination of (111) surface orientation and UTB InAs-OI structures is expected to transfer the electrons into the L valley with much heavierthan in thevalley, leading to higher semiconductor capacitance and suppression of thickness fluctuation scattering. We also experimentally demonstrate the UTB (111) InAs-OI nMOSFETs operation with thinning the InAs channels down to 3 nm, realized by the smart-cut and digital etching process. Channel thickness scaling improves both the OFF- and ON-currents by expansion of the effective bandgap. It is shown that the measured mobility increases with decreasing InAs-OI thickness from 4.8 to 4.4 nm, which is attributable to the increase in the electron occupancy in the L valley.