Microstructure and Electrical Conductivity of Electroless Pure Ni Plating Using Hydrazine as a Reducing Agent
Microstructure and Electrical Conductivity of Electroless Pure Ni Plating Using Hydrazine as a Reducing Agent
复制标题
肼作还原剂化学镀纯镍的显微组织和导电性能
DOI：
10.5104/jiep.8.233
复制
发表时间：
2005
期刊：
影响因子：
--
通讯作者：
H. Matsuda
中科院分区：
文献类型：
--
作者：
Kiyoshi Ito;N. Fukumuro;S. Yae;H. Matsuda
本研究的目的是阐明化学镀纯镍溶液的组成对沉积薄膜的微观结构和电导率的影响。测定了样品中杂质碳、硫和硼的含量，碳含量变化范围为0.01-0.19%(质量分数)。用横截面电子显微镜观察了沉积薄膜的晶体结构，对所得电子衍射图的研究表明，沉积薄膜的晶体总体上是无规则取向的。在所研究的薄膜中，颗粒尺寸是均匀的(1ƒ)，但随着溶液组成的不同，薄膜的直径从10 nm到120 nm不等：在高浓度的联氨溶液中沉积的薄膜中观察到相对较粗的颗粒。添加糖精钠一般会诱导颗粒生长。测量结果表明，薄膜的碳含量与晶粒度之间有很好的相关性，薄膜的电导率随碳含量的增加呈线性下降。
The objective of this study is to clarify the effect of the composition of electroless pure Ni solutions on the microstructure and electrical conductivity of deposited films. The carbon, sulfur and boron contents included as impurities in the samples have been measured, showing changes in the carbon content ranging from 0.01 to 0.19% by mass. The crystal structure of the deposited films was investigated by means of cross-sectional TEM observation, and investigation of the obtained electron diffraction patterns reveals that the crystals of the deposited films are generally oriented randomly. The grain size is uniform throughout the investigated film (1ƒÊm), though the diameter varies from 10 nm to 120 nm with changes in the solution composition: relatively coarse grains are observed in films deposited from a solution with a high hydrazine concentration. The addition of saccharin sodium generally induces grain growth. The results of the measurements suggest an adequate correlation between the carbon content and the grain size, and it has become evident that the electrical conductivity of the films decreases linearly with an increase of the carbon content.