Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate
Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate
复制标题
DOI：
10.1115/1.4031750
复制
发表时间：
2015-12
影响因子：
1.6
通讯作者：
Zhiyuan Zhu;M. Yu;Lisha Liu;Yufeng Jin
中科院分区：
文献类型：
--
作者：
Zhiyuan Zhu;M. Yu;Lisha Liu;Yufeng Jin
本文研究了基于碳酸丙烯酯（PPC）的临时键合/脱键。以纯PPC为粘结剂时，其抗剪强度最高，达4.1 MPa。研究了常温脱粘方法，并与热脱粘方法进行了比较。与纯PPC在室温下实现了化学脱键。几种不同的化学品可用于化学脱粘。在室温下，以PAG负载的PPC （PAG-PPC）作为粘接剂，研究了光酸发生器（PAG）辅助脱粘的方法。紫外（UV）辐射增强pag辅助脱粘。
This paper researches temporary bonding/debonding based on propylene carbonate (PPC). The highest shear strength of 4.1 MPa was achieved when pure PPC was used as bonding adhesive. Room temperature debonding methods were investigated and compared with thermal debonding. Chemical debonding at room temperature was realized for bonding with the pure PPC. Several different chemicals can be used for chemical debonding. A photo acid generator (PAG)-assisted debonding method was demonstrated at room temperature when PAG-loaded PPC (PAG-PPC) was used as bonding adhesive. The ultraviolet (UV) radiation was used to enhance the PAG-assisted debonding.