Measurement of transient temperature at super-high-speed deformation
Measurement of transient temperature at super-high-speed deformation
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DOI:
10.1016/j.ijmecsci.2021.106626
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发表时间:
2021-07-10
影响因子:
7.3
通讯作者:
Iwamoto, Takeshi
中科院分区:
文献类型:
--
作者:
Gao, Chong;Iwamoto, Takeshi
To evaluate the thermal behaviour of the materials at high strain rate, the thermocouple and infrared detector are widely employed for measuring the temperature rise in the strain rate range of 10(3) s(-1). However, it is hard to find challenges on measuring the temperature rise over 10(4) s(-1) of the strain rate. Here, both the type-T thermocouple with 80 it m in tip diameter and the infrared detector are introduced into a miniaturized testing apparatus based on the split Hopkinson pressure bar technique which is employed to achieve 10(4) s(-1) of the strain rate for measuring the temperature rise of the materials. The responsiveness of thermocouple and infrared detector is discussed based on the stress waves propagating in Hopkinson pressure bars. Then, the applicability of the thermocouple and infrared detector is also discussed by comparing the results obtained by a finite element simulation using commercial software and theoretical calculations. As a result, both the techniques have a high responsiveness and can be applied to measure the temperature rise in the strain rate range of 10(4)s(-1).