Study of system ESD codesign of a realistic mobile board

Study of system ESD codesign of a realistic mobile board
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DOI：
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发表时间：
2011-10
期刊：
EOS/ESD Symposium Proceedings
影响因子：
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通讯作者：
D. Johnsson;H. Gossner
D. Johnsson;H. Gossner
中科院分区：
其他
文献类型：
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作者：
D. Johnsson;H. Gossner

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基于一个移动的参考板，研究了一个完整的系统ESD IC/板协同设计流程。器件的精确大电流瞬态模型和提取的电路板寄生效应用于模拟IEC 61000-4-2脉冲第一个峰值期间的电压过冲效应
Based on a mobile reference board a full system ESD IC/board codesign flow was examined. Accurate high current transient models of the components and extracted board parasitics were used to simulate the effect of voltage overshoots during the first peak of the IEC 61000–4–2 pulse