32 and 45 nm Radiation-Hardened-by-Design (RHBD) SOI Latches
32 and 45 nm Radiation-Hardened-by-Design (RHBD) SOI Latches
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DOI:
10.1109/tns.2011.2171715
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发表时间:
2011-11
影响因子:
1.8
通讯作者:
K. Rodbell;D. Heidel;J. Pellish;Paul W. Marshall;Henry H. K. Tang;Conal E. Murray;Ken LaBel;Michael S. Gordon;Kevin Stawiasz;J. Schwank;M. Berg;Hak Kim;M. Friendlich;A. Phan;C. Seidleck
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文献类型:
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作者:
K. Rodbell;D. Heidel;J. Pellish;Paul W. Marshall;Henry H. K. Tang;Conal E. Murray;Ken LaBel;Michael S. Gordon;Kevin Stawiasz;J. Schwank;M. Berg;Hak Kim;M. Friendlich;A. Phan;C. Seidleck
Single event upset (SEU) experimental heavy ion data and modeling results for CMOS, silicon-on-insulator (SOI), 32 nm and 45 nm stacked and DICE latches are presented. Novel data analysis is shown to be important for hardness assurance where Monte Carlo modeling with a realistic heavy ion track structure, along with a new visualization aid (the Angular Dependent Cross-section Distribution, ADCD), allows one to quickly assess the improvements, or limitations, of a particular latch design. It was found to be an effective technique for making SEU predictions for alternative 32 nm SOI latch layouts.