Stress and grain growth in thin films
Stress and grain growth in thin films
复制标题
DOI：
10.1016/0022-5096(96)00022-1
复制
发表时间：
1996-05-01
影响因子：
5.3
通讯作者：
Carel, R
中科院分区：
文献类型：
--
作者：
Thompson, CV;Carel, R
The mechanical properties of polycrystalline thin films with thickness of 1 mu m or less depend strongly on the grain geometry, the grain size, and the way in which the crystallographic orientations of the grains are distributed. Grain growth during film formation or during post-deposition annealing can play a dominant role in defining these microstructural characteristics, and therefore, the mechanical properties of films. Stress can suppress or promote grain growth. In the latter case, stress promotes texture evolution during grain growth. Grain growth can serve as a stress relief mechanism in both elastically isotropic and anisotropic materials, and can also promote plastic yielding.
