Copper Electrodeposition by Hydrogen Evolution Assisted Electroplating (HEA) for Wearable Electronics
Copper Electrodeposition by Hydrogen Evolution Assisted Electroplating (HEA) for Wearable Electronics
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DOI：
10.23919/panpacific48324.2020.9059338
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发表时间：
2020-02
期刊：
影响因子：
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通讯作者：
Sabrina M. Rosa-Ortiz;A. Takshi
中科院分区：
文献类型：
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作者：
Sabrina M. Rosa-Ortiz;A. Takshi
与恒流电镀方法相比，一种名为析氢辅助(HEA)电镀的新技术极大地提高了铜的沉积速度，为设备与织物的直接集成开辟了新的场所，从而导致了有用的可穿戴电子产品的开发。HEA既可用于在涂覆多壁碳纳米管(MWCNTs)的模板轨道上印刷铜轨道，也可用于将表面安装电子器件(SMD)焊接到此类轨道上，从而展示了其多功能性，可用于防止织物损坏的特定应用。然而，在这个项目中，我们研究了在恒定析氢技术存在的情况下，如何在不同的电压范围内使用1000丹尼尔涂层Cordura尼龙、层压聚酯RipStop和100%维珍乙烯基进行铜沉积。以硫酸铜(CuSO4)和硫酸(H2SO4)为介质，在恒电位仪上施加-0.5V~−2.0V的电压，在0.1 mm厚的多壁碳纳米管轨道上横向沉积，利用循环伏安法获得均匀的沉积。使用扫描电子显微镜(SEM)观察了织物的结构和铜镀层随所用织物类型的变化。
A novel technique called hydrogen evolution assisted (HEA) electroplating, has dramatically shown enhancement to the deposition rate of copper compared to galvanostatic conventional electroplating methods, opening new venues for the direct integration of devices to fabrics leading to the development of useful wearable electronics. HEA can be used for both printing copper tracks on a multi-wall carbon nanotubes (MWCNTs) coated template tracks and soldering surface mount electronic devices (SMD) to such tracks, demonstrating its versatility to be used for specific applications in which fabric mutilation wants to be prevented. However, in this project we studied how copper deposition takes place at different voltage ranges using 1000 Denier Coated Cordura Nylon, Laminated Polyester Ripstop and 100% Virgin Vinyl in the constant presence of the hydrogen evolution technique. Cupric sulfate (CUSO4) and sulfuric acid (H2SO4) were used as the medium to allow a lateral deposition over a multi-wall carbon nanotube track of 0.1mm by the application of a voltage ranging between - 0.5V to −2.0V using a potentiostat to employ the cyclic voltammeter technique in order to achieve a uniform deposition. Structure of the fabrics and variation of the copper deposits with respect to the type of fabric used were observed using a scanning electron microscopy (SEM).