The effects of Cl− ion concentration and relative humidity on atmospheric corrosion behaviour of PCB-Cu under adsorbed thin electrolyte layer
The effects of Cl− ion concentration and relative humidity on atmospheric corrosion behaviour of PCB-Cu under adsorbed thin electrolyte layer
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DOI：
10.1016/j.corsci.2010.12.018
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发表时间：
2011-04
影响因子：
8.3
通讯作者：
Hualiang Huang;Z. Dong;Zhenyu Chen;Xingpeng Guo
中科院分区：
文献类型：
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作者：
Hualiang Huang;Z. Dong;Zhenyu Chen;Xingpeng Guo
采用阴极极化曲线和电化学阻抗谱研究了氯离子浓度和相对湿度对PCB-Cu在吸附薄电解质层下大气腐蚀行为的影响。结果表明，PCB-Cu腐蚀的阴极过程主要是氧和腐蚀产物的还原。阴极电流密度随着相对湿度和Cl−离子浓度的增加而增加。腐蚀速率最初以氧还原为主，但在腐蚀后期，由于腐蚀产物的积累，阳极过程开始影响腐蚀速率。
The effects of Cl−ion concentration and relative humidity on atmospheric corrosion behaviour of PCB-Cu under adsorbed thin electrolyte layer were investigated by cathodic polarization curves and electrochemical impedance spectroscopy. Results indicated that the cathodic process of PCB-Cu corrosion was dominated by the reduction of oxygen and corrosion products. The cathodic current density increased with increasing relative humidity and Cl−ion concentration. The corrosion rate was initially dominated by oxygen reduction, but at the later stage of corrosion, the anodic process began to affect the corrosion rate due to the accumulation of corrosion products.