A thermally-actuated latching MEMS switch matrix and driver chip for an automated distribution frame
A thermally-actuated latching MEMS switch matrix and driver chip for an automated distribution frame
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DOI:
10.1016/j.mechatronics.2016.05.011
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发表时间:
2016-12-01
期刊:
影响因子:
3.3
通讯作者:
Doutreloigne, Jan
中科院分区:
文献类型:
--
作者:
Dellaert, Dries;Doutreloigne, Jan
This paper presents a thermally-actuated latching MEMS switch matrix together with an integrated driver chip for controlling these switches. The novel thermal actuators are heated by making use of a polysilicon heater underneath the structure, which results in a more stable actuation and a facilitated driving. The designed driver can generate adjustable latching waveforms which are needed to latch the switch into a closed or open state. As the thermal actuators in the MEMS switch require voltages up to 24V, the high-voltage 0.35 mu m I3T50 technology of ON Semiconductor was used to fabricate the device. The driver, measuring 2 x 2 mm(2), contains 32 output drivers and can control a 4 x 4 latching switch matrix. This driver chip together with the latching MEMS switches were combined to create a prototype 2 x 2 double pole single-throw latching MEMS switch matrix. The proposed MEMS switch matrix could be used in the fixed-access telecommunication network in which it can implement a compact automated distribution frame for connecting twisted pairs. (C) 2016 Elsevier Ltd. All rights reserved.