Versatile low temperature wafer bonding and bond strength measurement by a blister test method
Versatile low temperature wafer bonding and bond strength measurement by a blister test method
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通过泡罩测试方法进行多功能低温晶圆键合和键合强度测量
DOI：
10.1007/s00542-005-0030-x
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发表时间：
2006
期刊：
影响因子：
--
通讯作者：
P. Woias
中科院分区：
文献类型：
--
作者：
A. Doll;M. Rabold;F. Goldschmidtböing;P. Woias
我们提出了一种低温等离子体辅助键合工艺，该工艺能够在低至室温的退火温度下将硅、氧化硅和氮化硅晶片彼此键合。该工艺可使用标准洁净室设备进行应用。不同处理的粘结样品的表面能通过方形空腔的起泡测试方法来确定。为此，我们扩展了著名的水泡测试方法为圆形的空腔，方形的情况下，由一个组合的分析和数值方法。相应地，通过数值模拟确定了粘结界面中的能量有利的裂纹前缘扩展。计算测试样品的表面能，并与阳极硅-Pyrex®键进行比较。在低退火温度下，硅和氧化硅晶片对之间可以实现高达2.6 J/m2的表面能。室温粘合样品显示出1.9 J/m2的表面能。硅-派热克斯玻璃键的表面能为1.3 J/m2。小型结构，例如，可以使用所讨论的键合工艺键合低至5 μm的桥。通过构造氧化物层来执行硅到氧化硅晶片对的选择性键合。的成功集成的键合过程中的微型泵的制造突出。
We present a low temperature plasma assisted bonding process that enables the bonding of silicon, silicon oxide and silicon nitride wafers among each other at annealing temperatures as low as room temperature. The process can be applied using standard clean room equipment. Surface energies of differently treated bonded samples are determined by a blister test method for square shaped cavities. For this reason, we extend the well-known blister test method for round shaped cavities to the square shaped case by a combined analytical and numerical approach. Accordingly, the energetic favored crack front propagation in the bond interface is determined by numerical simulations. The surface energies of the tested samples are calculated and compared to anodic silicon-to-Pyrex®bonds. Surface energies of up to 2.6 J/m2can be achieved between silicon and silicon oxide wafer pairs at low annealing temperatures. Room temperature bonded samples show a surface energy of 1.9 J/m2. The surface energy of silicon-to-Pyrex glass bonds yields 1.3 J/m2. Small structures, e.g., bridges down to 5 μm can be bonded using the discussed bonding process. Selective bonding of silicon-to-silicon oxide wafer pairs is performed by structuring the oxide layer. The successful integration of the bonding process into the fabrication of micropumps is highlighted.