SCALING LIMITATIONS OF SILICON MULTICHANNEL RECORDING PROBES
SCALING LIMITATIONS OF SILICON MULTICHANNEL RECORDING PROBES
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DOI：
10.1109/10.43605
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发表时间：
1990-01-01
影响因子：
4.6
通讯作者：
WISE, KD
中科院分区：
文献类型：
--
作者：
NAJAFI, K;JI, J;WISE, KD
描述了使用硅集成电路技术制造用于神经生理学的多通道记录探头的缩放限制。可使用硼蚀刻停止技术制造8 μ m厚和16 μ m宽的缩放硅探针衬底。导出了计算硅基片厚度和宽度的理论表达式，与实验结果吻合较好。描述了缩放探头尺寸对其强度和刚度的影响。探针柄尺寸可以设计为针对不同应用改变强度和刚度。缩放后的硅衬底的断裂应力约为2*10/sup 10/ dyn/cm/sup 2/，约为体硅的六倍，并且坚固且非常柔韧。将记录电极阵列的特征尺寸缩小到1 μ m是可能的，通道之间的电串扰小于1%。<>
The scaling limitations of multichannel recording probes fabricated for use in neurophysiology using silicon integrated circuit technologies are described. Scaled silicon probe substrates 8- mu m thick and 16- mu m wide can be fabricated using boron etch-stop techniques. Theoretical expressions for calculating the thickness and width of silicon substrates have been derived and agree closely with experimental results. The effects of scaling probe dimensions on its strength and stiffness are described. The probe shank dimensions can be designed to vary the strength and stiffness for different applications. The scaled silicon substrates have a fracture stress of about 2*10/sup 10/ dyn/cm/sup 2/, which is about six times that of bulk silicon, and are strong and very flexible. Scaling the feature sizes of recording electrode arrays down to 1 mu m is possible with less than 1% electrical crosstalk between channels.<>