Microscale Drilling of Bulk Metallic Glass

Microscale Drilling of Bulk Metallic Glass
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块状金属玻璃的微型钻孔

DOI:
10.1115/1.4025538
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发表时间:
2013
影响因子:
1
通讯作者:
S. Kapoor
S. Kapoor
中科院分区:
--
文献类型:
--
作者:
James Zhu;H. J. Kim;S. Kapoor

文献摘要

被引文献

相似文献

研究了一种Zr基大块非晶合金的微钻削性能。结晶,钻温度,轴向力,主轴负载(SL),声发射(AE),芯片形态,孔径,和入口毛刺高度测量和分析与不同的切削速度和芯片负载。使用立体显微镜技术评估工具磨损的进展。在小的芯片负载,最小芯片厚度(MCT)观察到从剪切为主的犁耕为主的政权切削力学。因此,观察到钻头不稳定和较大毛刺高度的证据。随着钻孔温度升高到玻璃化转变温度以上,BMG由于转变为过冷液态而热软化,并开始表现出粘性特性。在使用碳化钨微钻的刀具磨损研究中,发现前刀面磨损比后刀面磨损占主导地位。这归因于前刀面上的高扩散磨损率以及由于热软化引起的BMG粘性流动导致的硬度降低而导致的后刀面上的较低磨损的组合。
The microscale drilling performance of a Zr-based bulk metallic glass (BMG) is investigated in this paper. Crystallization, drill temperature, axial force, spindle load (SL), acoustic emissions (AE), chip morphology, hole diameter, and entry burr height are measured and analyzed with varying cutting speed and chip load. The progression of tool wear is assessed using stereo-microscopy techniques. At small chip loads, minimum chip thickness (MCT) is observed to shift cutting mechanics from a shear-dominated to a ploughing-dominated regime. Consequently, evidence of drill instability and larger burr height are observed. As drilling temperatures rise above the glass transition temperature, the BMG thermally softens due to the transition to a super-cooled liquid state and begins to exhibit viscous characteristics. In the tool wear study using tungsten carbide microdrills, rake wear is found to dominate compared to flank wear. This is attributed to a combination of a high rate of diffusion wear on the rake face as well as lower abrasion on the flank due to the decreased hardness from thermal softening-induced viscous flow of BMG.