A High Signal Integrity Interconnect Design Using a Genetic Algorithm and Its Solution Analysis

A High Signal Integrity Interconnect Design Using a Genetic Algorithm and Its Solution Analysis
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采用遗传算法的高信号完整性互连设计及其解决方案分析

DOI:
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发表时间:
2016
期刊:
Proc. of 2016 IEEE Electrical Design of Advanced Packaging & Systems Symposium(EDAPS 2016)
影响因子:
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通讯作者:
Shumpei Matsuoka and Moritoshi Yasunaga
Shumpei Matsuoka and Moritoshi Yasunaga
中科院分区:
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文献类型:
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作者:
Shumpei Matsuoka and Moritoshi Yasunaga

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