A vibronic approach to the band-filling and temperature-dependent metal-insulator transition.
A vibronic approach to the band-filling and temperature-dependent metal-insulator transition.
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能带填充和温度依赖性金属-绝缘体转变的电子振动方法。
DOI：
10.1063/1.1775769
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发表时间：
2004
期刊：
影响因子：
--
通讯作者：
V. Robert
中科院分区：
文献类型：
--
作者：
V. Robert
利用电子振动起源模型研究了低维材料中的金属-绝缘体相变这一重要问题。在零温条件下，单带模型链的稳定性由内部电子-声子耦合和最近邻跳跃积分之间的竞争控制。假设一个特定的变形模式，人们可以解析地推导出一个不稳定的标准，其中显式地包括带填充。载流子掺杂直接控制一维链的稳定性。对于半满带，Peierls不稳定性得到恢复。对于有限温度，一个类似的标准推导出来，并可以用来调查的金属-绝缘体的转变温度。
A model of vibronic origin is used to investigate the important issue of metal-insulator transition in low-dimensional materials. For zero temperature, the stability of the single-band model chain is controlled by the competition between the internal electron-phonon coupling and the nearest-neighbor hopping integral. Assuming one particular deformation mode, one can analytically derive an instability criterion in which the band filling is explicitly included. The carrier doping directly controls the stability of a one-dimensional chain. For a half-filled band, the Peierls instability is recovered. For finite temperatures, a similar criterion is derived and can be used to investigate the metal-insulator transition temperatures.