Very high-cycle fatigue failure in micron-scale polycrystalline silicon films : Effects of environment and surface oxide thickness
Very high-cycle fatigue failure in micron-scale polycrystalline silicon films : Effects of environment and surface oxide thickness
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微米级多晶硅薄膜的极高周疲劳失效:环境和表面氧化物厚度的影响
DOI:
10.1063/1.2403841
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发表时间:
2007
期刊:
影响因子:
--
通讯作者:
R. Ritchie
中科院分区:
文献类型:
--
作者:
D. Alsem;R. Timmerman;B. Boyce;E. Stach;J. Hosson;R. Ritchie
Fatigue failure in micron-scale polycrystalline silicon structural films, a phenomenon that is not observed in bulk silicon, can severely impact the durability and reliability of microelectromechanical system devices. Despite several studies on the very high-cycle fatigue behavior of these films (up to 1012cycles), there is still an on-going debate on the precise mechanisms involved. We show here that for devices fabricated in the multiuser microelectromechanical system process (MUMPs) foundry and Sandia Ultra-planar, Multi-level MEMS Technology (SUMMiT V™) process and tested under equi-tension/compression loading at ∼40kHz in different environments, stress-lifetime data exhibit similar trends in fatigue behavior in ambient room air, shorter lifetimes in higher relative humidity environments, and no fatigue failure at all in high vacuum. The transmission electron microscopy of the surface oxides in the test samples shows a four- to sixfold thickening of the surface oxide at stress concentrations after fat...
DOI:
10.1007/978-0-387-92897-5_100470
发表时间:
1991
期刊:
--
影响因子:
--
作者:
S. Suresh
通讯作者:
S. Suresh