Very high-cycle fatigue failure in micron-scale polycrystalline silicon films : Effects of environment and surface oxide thickness

Very high-cycle fatigue failure in micron-scale polycrystalline silicon films : Effects of environment and surface oxide thickness
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微米级多晶硅薄膜的极高周疲劳失效:环境和表面氧化物厚度的影响

DOI:
10.1063/1.2403841
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发表时间:
2007
期刊:
影响因子:
--
通讯作者:
R. Ritchie
R. Ritchie
中科院分区:
--
文献类型:
--
作者:
D. Alsem;R. Timmerman;B. Boyce;E. Stach;J. Hosson;R. Ritchie

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微米级多晶硅结构薄膜中的疲劳失效是体硅中未观察到的现象,会严重影响微机电系统器件的耐用性和可靠性。尽管对这些薄膜的高周疲劳行为(高达 1012 次循环)进行了多项研究,但对于所涉及的精确机制仍然存在持续的争论。我们在此表明​​,对于在多用户微机电系统工艺 (MUMP) 铸造厂和桑迪亚超平面多级 MEMS 技术 (SUMMiT V™) 工艺中制造的器件,并在不同环境中以 ~40kHz 等张力/压缩负载进行测试,应力寿命数据在室内空气中的疲劳行为方面表现出相似的趋势,在较高相对湿度环境中寿命较短,并且在高真空中根本没有疲劳失效。测试样品中表面氧化物的透射电子显微镜显示,在脂肪处理后,在应力集中,表面氧化物增厚了四到六倍...
Fatigue failure in micron-scale polycrystalline silicon structural films, a phenomenon that is not observed in bulk silicon, can severely impact the durability and reliability of microelectromechanical system devices. Despite several studies on the very high-cycle fatigue behavior of these films (up to 1012cycles), there is still an on-going debate on the precise mechanisms involved. We show here that for devices fabricated in the multiuser microelectromechanical system process (MUMPs) foundry and Sandia Ultra-planar, Multi-level MEMS Technology (SUMMiT V™) process and tested under equi-tension/compression loading at ∼40kHz in different environments, stress-lifetime data exhibit similar trends in fatigue behavior in ambient room air, shorter lifetimes in higher relative humidity environments, and no fatigue failure at all in high vacuum. The transmission electron microscopy of the surface oxides in the test samples shows a four- to sixfold thickening of the surface oxide at stress concentrations after fat...
DOI: 10.1007/978-0-387-92897-5_100470
发表时间: 1991
期刊: --
影响因子: --
作者:
S. Suresh
通讯作者: S. Suresh