Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature
Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature
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DOI：
10.1007/s11664-011-1756-0
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发表时间：
2012-02-01
影响因子：
2.1
通讯作者：
Cotts, E. J.
中科院分区：
文献类型：
--
作者：
Arfaei, B.;Kim, N.;Cotts, E. J.
采用不同的凝固温度制备了不同尺寸和几何形状的Sn-Ag-Cu近共晶样品。Sn晶粒的形貌的样品进行了表征，并发现与样品的凝固温度相关;凝固温度越低，观察到的交错程度越高。观察到这些Sn晶粒形态与一个简单的模型一致，该模型设想过冷Sn-Ag-Cu液体中的核是以六方构型聚集在Ag原子周围的Sn原子，该构型允许Sn在其每个表面上外延生长。在中等程度的过冷度，观察到的混合锡晶粒形态，与交错的部分与该区域更接近锡在这些样品中的成核。
Near-eutectic Sn-Ag-Cu samples were produced in different sizes and geometries, with different solidification temperatures. The Sn grain morphologies of samples were characterized and found to be correlated with the sample solidification temperature; the lower the solidification temperature, the higher the degree of interlacing observed. These Sn grain morphologies were observed to be consistent with a simple model that envisions the nucleus in an undercooled Sn-Ag-Cu liquid to be Sn atoms clustered around a Ag atom in a hexagonal configuration that allows Sn to grow epitaxially on each of its surfaces. At intermediate degrees of undercooling, a mixed Sn grain morphology is observed, with the interlaced portion associated with the region closer to Sn nucleation in these samples.