Fast simulation of VLSI interconnects

Fast simulation of VLSI interconnects
复制标题

VLSI互连的快速仿真

DOI:
10.1109/iccad.2004.1382549
复制
发表时间:
2004
期刊:
IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004.
影响因子:
--
通讯作者:
V. Balakrishnan
V. Balakrishnan
中科院分区:
--
文献类型:
--
作者:
J. Jain;Cheng;V. Balakrishnan

文献摘要

被引文献

相似文献

本文介绍了一种高效、准确的互连仿真技术。提出了一种典型VLSI互连结构的新公式,该公式除了提供一组紧凑的建模方程外,还提供了在模拟级别利用稀疏性的潜力。仿真结果表明,与INDUCTWISE相比,我们的方法在计算时间和内存方面可以提高50/SPL倍(而INDUCTWISE的计算速度是SPICE的400/SPL倍/更快),同时保持了模拟的准确性。
This work introduces an efficient and accurate interconnect simulation technique. A new formulation for typical VLSI interconnect structures is proposed which, in addition to providing a compact set of modeling equations, also offers a potential for exploiting sparsity at the simulation level. Simulations show that our approach can achieve 50 /spl times/ improvement in computation time and memory over INDUCTWISE (which in turn has been shown to be 400 /spl times/ faster than SPICE) while preserving simulation accuracy.