Subsurface damage assessment with atomic force microscopy
Subsurface damage assessment with atomic force microscopy
复制标题
DOI:
--
复制
发表时间:
1999-04
期刊:
影响因子:
--
通讯作者:
J. Carr;E. Fearon;I. Hutcheon;L. Summers
中科院分区:
文献类型:
--
作者:
J. Carr;E. Fearon;I. Hutcheon;L. Summers
The performance of transparent optics in high fluence applications is often dominated by inhomogeneities in the first few hundred nanometers of material. Defects undetectable with optical methods can cause catastrophic failures when used in critical applications where high strength, chemical or mechanical resistance or extreme smoothness is required. Not only are these defects substantially smaller than the wavelength of visible light, they are often concealed below a layer of glass-like material deposited during the polishing process. In high quality glass, the chemical and material properties of the outermost layer are modified by the grinding, lapping and polishing processes used in fabrication. Each succeeding step in a process is designed to remote damage from the previous operation. However, any force against the surface, no matter how slight will leave evidence of this damage. These processes invariably create dislocations, cracks and plastic deformation in the subsurface region.