Very long CMOS linear array image sensor assembled in a ceramic 554 pin grid array package
Very long CMOS linear array image sensor assembled in a ceramic 554 pin grid array package
复制标题
超长 CMOS 线性阵列图像传感器，采用陶瓷 554 引脚网格阵列封装
DOI：
10.1109/estc.2016.7764505
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发表时间：
2016
期刊：
影响因子：
--
通讯作者：
Z. Timov
中科院分区：
文献类型：
--
作者：
V. Georgel;S. Boillet;M. Migette;C. Alluis;P. Reber;I. Gigante;K. Ono;J. Mercado;W. Iandolo;F. Daguse;Z. Timov
针对工业检测和机器视觉等非典型尺寸的应用，研制了一种基于多层陶瓷封装的CMOS线列阵图像传感器。这种传感器的整体机械特性并不常见；感光区域由一维32640个像素组成。我们研究了不同的封装结构，以满足图像传感器固有的机械性能要求。像素区域的平坦度是最重要的特征之一，考虑到尺寸，将其保持在尽可能低的水平是一个很大的挑战，必须谨慎管理。
The development of a CMOS linear array image sensor assembled in a multilayer ceramic package for industrial inspection and machine vision applications with atypical dimensions is the object of this paper. The global mechanical characteristics of this sensor are not common; the photosensitive area is composed of 32640 pixels in one dimension. We studied different package's structures, which need to meet the mechanical specifications inherent of the image sensors. Flatness of the pixel area is one of the most important characteristic and considering the dimensions, keeping it as low as possible is a big challenge and has to be managed carefully.