Sensitivity of laser powder bed fusion additive manufactured HAYNES230 to composition and print parameters

Sensitivity of laser powder bed fusion additive manufactured HAYNES230 to composition and print parameters
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DOI:
10.1016/j.jmrt.2021.11.080
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发表时间:
2021-12-02
影响因子:
6.4
通讯作者:
Momeni, Kasra
Momeni, Kasra
中科院分区:
材料科学1区
文献类型:
--
作者:
Momeni, Kasra

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我们开发了一个耦合的CALPHAD和有限元为基础的计算模型的激光粉末床聚变(LPBF)过程的HAYNES 230,考虑原料成分和堆积密度。我们进一步使用该模型来研究原料成分和打印参数的变化对最终打印部件质量的影响。最大达到的温度的激光源的特性的变化的灵敏度也进行了研究,考虑一个单一的跟踪激光扫描的金属粉末层。我们分析了粉末床中的温度演化和熔池的几何形状沿着激光的路径。我们的研究结果表明,HAYNES 230合金的LPBF工艺与其他合金相比需要约20 mm的粉末层厚度和约30 mm半径的激光光斑尺寸。重要的是,实现与基底粘合所需的足够的熔池深度,同时避免不利地影响裂纹和残余应力的形成的大熔池宽度。我们还发现,降低激光功率或增加扫描速度大大降低峰值温度,而不太容易受到溶质成分。(c)2021年,任作者。由爱思唯尔有限公司出版。这是一篇开放获取的文章,获得了CC BY-NC-ND许可证(http://creativecommons.org/licenses/by-nc-nd/4.0/)。
We developed a coupled CALPHAD and finite element-based computational model of the Laser Powder Bed Fusion (LPBF) process for HAYNES230, considering the feedstock composition and packing density. We further used this model to investigate the effect of variation in feedstock composition and print parameters on the quality of the final printed part. Sensitivity of the maximum reached temperature to variations in characteristics of the laser source is also studied considering a single-track laser scan on a layer of metal powder. We analyzed temperature evolution in the powder bed and melt pool geometry along the path of the laser. Our results indicate that the LPBF process of HAYNES230 alloy requires a powder layer thickness of -20 mm and laser spot size -30 mm radius compared to other alloys. It is essential to achieve sufficient melt pool depth necessary for cohesion with the substrate while avoiding large melt pool width that adversely affects the formation of cracks and residual stresses. We also revealed that reducing the laser power or increasing scan speed drastically reduces peak temperature while less susceptible to solute composition. (c) 2021 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).