Modelling of partially wet particles in DEM simulations of a solid mixing process
Modelling of partially wet particles in DEM simulations of a solid mixing process
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固体混合过程 DEM 模拟中部分湿颗粒的建模
DOI:
10.1016/j.powtec.2018.07.028
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发表时间:
2018
影响因子:
5.2
通讯作者:
H. Nirschl
中科院分区:
文献类型:
--
作者:
S. Schmelzle;E. Asylbekov;B. Radel;H. Nirschl
It is the basic objective of a solid mixing process to avoid any segregation effects. Especially free-flowing bulk solids with weak interparticle adhesive forces tend to percolating segregation. Liquid addition, which is common in mixing granulation processes, will usually reduce the particle segregation due to pendular liquid bridge networks. However, liquid addition can result in a change of the segregation mechanism. For example: water may accumulate selectively in one component when hydrophilic and hydrophobic solids need to be mixed. Heteroagglomerates that consist mainly of one solid component may arise and degrade the final product quality.In this work the Discrete Element Method (DEM) is applied to investigate mixing and segregation of moist particulate solids in more detail. During particle collision liquid is transferred from one to the other contact partner until the liquid is uniformly distributed in the bulk. The available liquid bridge models assume complete particle wetting or neglect that the mixing components may differ in their contact angle. We developed the liquid contact dispersion model further in order to realize partial particle wetting that includes drop formation on the particle surface. A comparison between the common film model and the proposed model shows an improvement in experimental validation when the partial particle wetting model is included in the DEM simulation. The assessment of these models is carried out by evaluating mixing efficiency and liquid distribution.
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DOI:
--
发表时间:
2010
期刊:
影响因子:
--
作者:
Raivat Patel;Dawei Wang;C. Zhu
通讯作者:
C. Zhu
影响因子:
2.4
作者:
Roman Mani;D. Kadau;H. Herrmann
通讯作者:
Roman Mani;D. Kadau;H. Herrmann
DOI:
--
发表时间:
2016
期刊:
影响因子:
--
作者:
Kimiaki Washino;Koki Miyazaki;T. Tsuji;Toshitsugu Tanaka
通讯作者:
Toshitsugu Tanaka
影响因子:
2.4
作者:
S. Schmelzle;H. Nirschl
通讯作者:
H. Nirschl
影响因子:
5.2
作者:
R. Turton
通讯作者:
R. Turton