Change in Microstructure and Texture during Annealing of Pure Copper Heavily Deformed by Accumulative Roll Bonding
Change in Microstructure and Texture during Annealing of Pure Copper Heavily Deformed by Accumulative Roll Bonding
复制标题
累积滚压大变形纯铜退火过程中显微组织和织构的变化
DOI：
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发表时间：
2007
期刊：
影响因子：
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通讯作者：
N. Tsuji
中科院分区：
文献类型：
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作者：
N. Takata;K. Yamada;K. Ikeda;F. Yoshida;H. Nakashima;N. Tsuji
