Suppression of Bacterial Decomposition in Water-based Cutting Fluids. Effect of copper complexes on the growth of sulfate-reducing bacteria.

Suppression of Bacterial Decomposition in Water-based Cutting Fluids. Effect of copper complexes on the growth of sulfate-reducing bacteria.
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抑制水基切削液中的细菌分解。

DOI:
10.2473/shigentosozai.115.240
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发表时间:
1999
期刊:
Shigen-to-sozai
影响因子:
--
通讯作者:
H. Nishio
H. Nishio
中科院分区:
--
文献类型:
--
作者:
T. Hirajima;K. Sasaki;T. Haga;H. Onuma;M. Tsunekawa;H. Nishio

文献摘要

被引文献

相似文献

水基切削液的一个主要问题是细菌繁殖,这会迅速破坏切削液的有效性并导致酸败气味。研究了三乙醇胺铜(Cu-TEA)和乙二胺四乙酸二钠铜(Cu-EDTA)对硫酸盐还原菌(SRB)殖民地形成活性的影响。通过在硫酸铜溶液中直接加入TEA或EDTA或在络合剂溶液中与铜电极电解制备铜络合物。在铜配合物中,铜离子与TEA或EDTA的摩尔比分别为1:1。添加Cu-TEA或Cu-EDTA对SRB的生长有一定的影响,当铜浓度为0.1mmol dm-3时,SRB的生长受到强烈抑制。从现有的数据来看,在硫酸盐还原菌的殖民地形成方面,铜配合物之间没有观察到明显的差异。
A major problem with water-based cutting fluids is bacterial propagation that can quickly ruin the fluid's effectiveness and cause rancid smell. Effects of copper triethanolamine (Cu-TEA) and copper ethylenediaminetetraacetic acid, disodium (Cu-EDTA) on the colony forming activity of sulfate-reducing bacteria (SRB) have been investigated. The copper complexes were prepared by direct addition of TEA or EDTA to the copper sulfate solution, or by electrolysis with copper electrode in complexing agent solutions. In the copper complexes, the mole ratio of copper ions to TEA or EDTA was 1:1, respectively. The growth of SRB was affected by the addition of Cu-TEA or Cu-EDTA and inhibited strongly at 0.1 mmol dm-3 copper concentration. From the data available, no obvious difference was observed between the copper complexes regarding the colony formation of SRB.