Suppression of Bacterial Decomposition in Water-based Cutting Fluids. Effect of copper complexes on the growth of sulfate-reducing bacteria.
Suppression of Bacterial Decomposition in Water-based Cutting Fluids. Effect of copper complexes on the growth of sulfate-reducing bacteria.
复制标题
抑制水基切削液中的细菌分解。
DOI:
10.2473/shigentosozai.115.240
复制
发表时间:
1999
期刊:
影响因子:
--
通讯作者:
H. Nishio
中科院分区:
文献类型:
--
作者:
T. Hirajima;K. Sasaki;T. Haga;H. Onuma;M. Tsunekawa;H. Nishio
A major problem with water-based cutting fluids is bacterial propagation that can quickly ruin the fluid's effectiveness and cause rancid smell. Effects of copper triethanolamine (Cu-TEA) and copper ethylenediaminetetraacetic acid, disodium (Cu-EDTA) on the colony forming activity of sulfate-reducing bacteria (SRB) have been investigated. The copper complexes were prepared by direct addition of TEA or EDTA to the copper sulfate solution, or by electrolysis with copper electrode in complexing agent solutions. In the copper complexes, the mole ratio of copper ions to TEA or EDTA was 1:1, respectively. The growth of SRB was affected by the addition of Cu-TEA or Cu-EDTA and inhibited strongly at 0.1 mmol dm-3 copper concentration. From the data available, no obvious difference was observed between the copper complexes regarding the colony formation of SRB.