Rapid thermal N2O oxynitride on Si(100)
Rapid thermal N2O oxynitride on Si(100)
复制标题
Si(100) 上快速热 N2O 氮氧化物
DOI:
10.1116/1.588929
复制
发表时间:
1996
影响因子:
1.4
通讯作者:
S. Tay
中科院分区:
文献类型:
--
作者:
Z. Lu;R. J. Hussey;M. J. Graham;R. Cao;S. Tay
High‐resolution x‐ray photoelectron spectroscopy (XPS) in conjunction with secondary‐ion‐mass spectrometry was used to study the chemical nature and distribution of N in oxynitride films formed by rapid thermal N2O processes (RTPs) or conventional furnace methods. The kinetics of furnace oxide growth in N2O are slower than that in O2. During reoxidation the oxidation rate increased to that in pure O2 and the N in the SiO2–Si interface region is displaced into the bulk of the oxide. High‐resolution synchrotron Si 2p core‐level photoemission spectroscopy (PES) was used to study the oxide–Si(100) interface suboxide structures produced by RTP with and without the presence of N. XPS N 1s studies indicated that there are two types of N in the RTP oxynitride films. The chemical bond configuration of the first type of N is similar to that of N in Si3N4 and is mainly distributed within the first 1 nm from the interface. The second type of N is distributed mainly outside of the first 1 nm region, and the N is likel...