Shock response and defect evolution of copper single crystals at room and elevated temperatures
Shock response and defect evolution of copper single crystals at room and elevated temperatures
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DOI：
10.1088/1361-651x/abea68
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发表时间：
2021-02
影响因子：
1.8
通讯作者：
Q. Xiong;T. Shimada;T. Kitamura;Zhenhua Li
中科院分区：
文献类型：
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作者：
Q. Xiong;T. Shimada;T. Kitamura;Zhenhua Li
采用分子动力学模拟方法研究了铜单晶在室温和高温下的冲击压缩行为。结果表明：随着初始温度的升高，应力的动能部分增大，势能部分减小;随着温升的增大，剪切应变和缺陷密度减小。为了了解初始温度对冲击响应的影响，详细研究了不同初始温度下位错的演化。最后，还研究和分析了初始温度对准静态压缩行为的影响。
Shock compression behaviors of copper single crystals at room and elevated temperatures are investigated by molecular dynamics simulations. The results show that when increasing the initial temperature, the kinetic energy part of stress increases while the potential energy part of stress decreases; the shear strain and the density of defects decrease while the magnitude of temperature rise increases. To understand the effect of initial temperature on the shock response, the evolutions of dislocations under different initial temperatures are studied in detail. Finally, the effect of initial temperature on quasi-static compression behavior is also investigated and analyzed.