Immersion-cooled heat sinks for electronics: insight from high-speed photography
Immersion-cooled heat sinks for electronics: insight from high-speed photography
复制标题
用于电子产品的浸没式冷却散热器：高速摄影的见解
DOI：
10.1109/itherm.2000.866208
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发表时间：
2000
期刊：
影响因子：
--
通讯作者：
R. Jaeger
中科院分区：
文献类型：
--
作者：
S. Bhavnani;Gilbert Fournelle;R. Jaeger
为典型便携式电子设备的主要散热部件开发有效的散热器是一项持续的挑战。使用空气冷却的热管理受到冷却剂固有的较差热性能的限制。如果可以可靠地预测基本机制，其他替代方案，包括液浸冷却、相变材料和热管，可能值得考虑。这项研究揭示了用于浸没式冷却散热器的蚀刻空腔增强表面的成核特性。目标应用是具有多个散热源的高密度多芯片模块。使用高速摄影来记录气泡相互作用、气泡尺寸、离开频率和活性位点密度等参数，同时改变空腔间距和热通量。这些空腔大约为 40 个/spl mu/m，排列成每边 12.7 毫米的方形簇。据确定，潜热作为散热机制的贡献很小（小于 16%）。另外，提出可以将潜热耗散百分比作为热性能指标。还研究了相邻热源之间的相互作用。这些相互作用降低了气泡离开频率，从而影响了潜热贡献。
The development of effective heat sinks for the primary heat-dissipating component of a typical portable electronics device is an ongoing challenge. Thermal management using air-cooling is limited by the inherently poor thermal properties of the coolant. Other alternatives, including liquid immersion cooling, phase-change materials, and heat pipes, may merit consideration if the basic mechanisms can be reliably predicted. This study sheds light on the nucleation characteristics of an etched cavity-enhanced surface for use in an immersion-cooled heat sink. The target application is a high-density multi-chip module with several heat dissipating sources. High-speed photography was used to record parameters such as bubble interactions, bubble size, departure frequency and active site density while varying the cavity spacing and heat flux. The cavities, which are approximately 40 /spl mu/m, are arranged in a square cluster 12.7 mm on each side. It was determined that the contribution of latent heat as a heat dissipation mechanism is only minor (less than 16%). In addition, it is proposed that the latent heat dissipation percentage may be used as a thermal performance indicator. Interactions between neighboring heat sources were also studied. These interactions decreased the bubble departure frequency and thereby affected the latent heat contribution.