11.8 Chip-scale electro-optical 3D FMCW lidar with 8μm ranging precision
11.8 Chip-scale electro-optical 3D FMCW lidar with 8μm ranging precision
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11.8 芯片级光电3D FMCW激光雷达，测距精度8μm
DOI：
10.1109/isscc.2016.7417983
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发表时间：
2016
期刊：
影响因子：
--
通讯作者：
B. Boser
中科院分区：
文献类型：
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作者：
Behnam Behroozpour;Phillip A. M. Sandborn;N. Quack;T. J. Seok;Y. Matsui;Ming C. Wu;B. Boser
具有亚毫米精度的小型化3D成像系统对于诸如高保真3D复制的应用具有高度的兴趣。与基于雷达和超声波的相机相比，采用光探测和测距（激光雷达）单元的3D相机提供更好的空间和深度分辨率[1-5]。虽然在常见的激光雷达架构中使用短脉冲的往返延迟[3]（所谓的“脉冲激光雷达”）或连续波（CW）光的强度包络的相位延迟（“调幅（AM）-CW激光雷达”）[4]来测量深度，但这些架构需要亚皮秒的定时分辨率，并与高功耗和大面积相称，以实现亚毫米深度精度。
Miniaturized 3D imaging systems with sub-mm precision are of high interest for applications such as high-fidelity 3D copying. 3D cameras that employ light-detection-and-ranging (lidar) units offer better spatial and depth resolution compared to radar- and ultrasonic-based cameras [1-5]. While depth is measured in common lidar architectures using the round-trip delay of a short pulse [3] (so-called “pulsed lidar”) or the phase-delay of an intensity envelope on continuous-wave (CW) light (“amplitude-modulated (AM)-CW lidar”) [4], these architectures require sub-picosecond timing resolution and commensurate with high power dissipation and large area for sub-millimeter depth precision.