Contact angles by the solid-phase grain boundary wetting (coverage) in the Co–Cu system
Contact angles by the solid-phase grain boundary wetting (coverage) in the Co–Cu system
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DOI:
10.1007/s10853-010-4377-8
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发表时间:
2010-03
影响因子:
4.5
通讯作者:
B. Straumal;O. Kogtenkova;A. Straumal;Yu. O. Kuchyeyev;B. Baretzky
中科院分区:
文献类型:
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作者:
B. Straumal;O. Kogtenkova;A. Straumal;Yu. O. Kuchyeyev;B. Baretzky
The microstructure of binary Co–13.6 wt% Cu and Cu–4.9 wt% Co alloys after long anneals (930–2,100 h) was studied between 880 and 1,085 °C. The contact angles between (Co) particles and (Cu)/(Cu) grain boundaries (GBs) in the Cu–4.9 wt% Co alloy are between 50° and 70°. In the Co–13.6 wt% Cu alloy, the transition from incomplete to complete wetting (coverage) of (Co)/(Co) GBs by the second solid phase (Cu) has been observed. The portion of completely wetted (Co)/(Co) GBs increases with increasing temperature beginning fromTwss= 970 ± 10 °C and reaches a maximum of 15% at 1,040 °C. This temperature is very close to the Curie point in the Co–Cu alloys (1,050 °C). Above 1,040 °C, the amount of completely wetted (Co)/(Co) GBs decreases with increasing temperature and reaches zero atTwsf= 1,075 ± 5 °C. Such reversible transition from incomplete to complete wetting (coverage) of a GB by a second solid phase is observed for the first time.