Development of differential thermal resistance method for thermal conductivity measurement down to microscale
Development of differential thermal resistance method for thermal conductivity measurement down to microscale
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DOI:
10.1016/j.ijheatmasstransfer.2022.123712
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发表时间:
2023-03
影响因子:
5.2
通讯作者:
Mahya Rahbar;Meng Han;Shen Xu;Hamidreza Zobeiri;Xinwei Wang
中科院分区:
文献类型:
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作者:
Mahya Rahbar;Meng Han;Shen Xu;Hamidreza Zobeiri;Xinwei Wang
The thermal conductivity (k) of materials plays a critical role in the effectiveness of devices in the engineering fields. In this work, a novel differential thermal resistance (DTR) method is developed to measure the out-of-plane and in-planekof mm- down to μm-thick samples. Traditional techniques for directkmeasurement usually needs measuring the heat transfer and temperature difference across the sample. The DTR technique rather constructs configurations for reference samples and sample of interest to measure the temperature rise and determine the thermal resistance of the sample and itsk. Non-contact heating by laser and thermal probing by a high-sensitivity infrared camera are employed. The out-of-planekof 1.49 and 2.81 mm-thick acrylic samples, and 1 mm-thick glass slide is measured to be 0.20, 0.19, and 1.27 W·m−1·K−1, respectively. The in-planekof a 26 μm-thick graphene paper is measured to be 616 W·m−1·K−1. A good level of agreement is obtained between our measurement results and reference values. Moreover, the in-planekof 15 μm-thick pure copper foil is measured to be 322 W·m−1·K−1, very well agreeing with the density-adjusted value of 326 W·m−1·K−1for pure copper. Also by measuring the copper coil's electrical conductivity, we are able to determine its Lorenz number as (2.21-2.30) × 10−8W·Ω·K−2which agrees well with reference values of (2.23-2.33) × 10−8W·Ω·K−2.