Clamping Force Effects on the Performance of Mechanically Attached Piezoelectric Transducers for Impedance-Based NDE
Clamping Force Effects on the Performance of Mechanically Attached Piezoelectric Transducers for Impedance-Based NDE
复制标题
夹紧力对基于阻抗的无损检测的机械连接压电换能器性能的影响
DOI:
10.1007/978-3-030-12676-6_33
复制
发表时间:
2019
期刊:
影响因子:
--
通讯作者:
Tenney, C.
中科院分区:
文献类型:
--
作者:
Tenney, C.
Impedance-based non-destructive evaluation (NDE) constitutes a generalization of structural health monitoring (SHM), where comparisons between known-healthy reference structures and potentially-defective structures are used to identify damage. The quantity considered by impedance-based NDE is the electrical impedance of a piezoelectric element bonded to the part under test, which is linked to the dynamic vibrational response of the part under test through electromechanical coupling. In this work, the piezoelectric element is not bonded directly to the part under test, but rather to a c-shaped clamp, which is then mechanically attached to the part under test. Under this attachment condition, the effect of clamping force on the sensitivity of the impedance-based evaluation is investigated for machined steel blocks with varying levels of damage severity. The highest clamping force tested (600 lb, 2670 N) was the only condition exhibiting increasing damage metric values with increasing damage severity in the parts under test, suggesting that higher clamping force increases sensitivity to damage.
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DOI:
10.1115/1.2775506
发表时间:
2007
期刊:
Journal of Vibration and Acoustics
影响因子:
--
作者:
D. Peairs;P. Tarazaga;D. Inman
通讯作者:
D. Inman
DOI:
--
发表时间:
2018
期刊:
IMAC XXXVI A Conference and Exposition on Structural Dynamics,
影响因子:
--
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C. Tenney, M. I.
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C. Tenney, M. I.
DOI:
10.1098/rspa.2007.1834
发表时间:
2007-06
期刊:
Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences
影响因子:
--
作者:
K. Worden;C. Farrar;G. Manson;G. Park
通讯作者:
K. Worden;C. Farrar;G. Manson;G. Park
DOI:
10.1115/smasis2017-3856
发表时间:
2017
期刊:
Adaptive Structures and Intelligent Systems
影响因子:
--
作者:
Tenney, Charles;Albakri, Mohammad I.;Kubalak, Joseph;Sturm, Logan D.;Williams, Christopher B.;Tarazaga, Pablo A.
通讯作者:
Tarazaga, Pablo A.
影响因子:
3.9
作者:
Albakri, Mohammad I.;Sturm, Logan D.;Tarazaga, Pablo A.
通讯作者:
Tarazaga, Pablo A.