Sustainability analysis of atomic layer deposition for microelectronics manufacturing
Sustainability analysis of atomic layer deposition for microelectronics manufacturing
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DOI：
10.1115/1.4001686
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发表时间：
2009-05
期刊：
影响因子：
--
通讯作者：
C. Yuan;D. Dornfeld
中科院分区：
文献类型：
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作者：
C. Yuan;D. Dornfeld
随着半导体制造业小型化趋势的不断发展，原子层沉积由于能够获得原子层控制薄膜生长[1]b[2]而受到近年来的广泛关注。ALD的工作原理是将表面交替暴露于两种或两种以上化学反应物的蒸气中，在表面沉积原子层薄膜。根据需要，可以重复沉积过程以获得特定厚度的膜层。ALD可以在极其复杂的表面上沉积高度均匀和保形的薄膜，因此在包括CMOS芯片、平板显示器、光学滤光片等多种电子产品上具有潜在的应用前景。
As the miniaturization trend continues in the semiconductor manufacturing industry, atomic layer deposition has received much attention in recent years due to its ability to obtain atomic layer control of film growth [1][2]. ALD operates by alternating exposure of a surface to vapors of two or more chemical reactants to deposit an atomic layer film on the surface. As needed, the deposition process can be repeated to obtain a film layer for a specific thickness. ALD can deposit highly uniform and conformal thin films on extremely complex surfaces [3], and accordingly, has potential applications on a wide variety of electronic products including CMOS chips, flat panel display, optical filters, etc.[4].