Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-Based Interconnects
Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-Based Interconnects
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极其灵活（1mm 弯曲半径）生物相容性异质扇出晶圆级平台，具有最低的芯片移位 (<6 µm) 和可靠的柔性铜基互连
DOI：
10.1109/ectc.2018.00229
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发表时间：
2018
期刊：
影响因子：
--
通讯作者：
S. Iyer
中科院分区：
文献类型：
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作者：
A. Hanna;A. Alam;T. Fukushima;S. Moran;William Whitehead;SivaChandra Jangam;Saptadeep Pal;G. Ezhilarasu;R. Irwin;A. Bajwa;S. Iyer
采用柔性扇形外圆片级封装（FOWLP）工艺，在柔性和生物相容性弹性体封装（FlexTrateTM）中异质集成高性能芯片，组装了共平面度和倾角<1 μ m、平均模移为3.28 μ m的bbb600芯片。< 2.23µm。我们还设计了一种新颖的波纹状应力缓冲层，用于FlexTrateTM上的金属互连，以减轻沉积在弹性体衬底上的金属膜的屈曲现象。然后对波纹互连进行了机械弯曲可靠性测试，在以1mm半径弯曲1000次后，电阻变化小于0.4%。最后，我们展示了在40µm互连间距的菊花链配置中互连的25个dielets阵列的集成。
A flexible fan-out wafer-level packaging (FOWLP) process for heterogeneous integration of high performance dies in a flexible and biocompatible elastomeric package (FlexTrateTM) was used to assemble >600 dies with co-planarity and tilt <1µm, average die-shift of 3.28 µm with ? < 2.23 µm. We have also engineered a novel corrugated topography of a stress buffer layer for metal interconnects on FlexTrateTM to mitigate the buckling phenomenon of metal films deposited on elastomeric substrates. Corrugated interconnects were then tested for their mechanical bending reliability and have shown less than 0.4% change in resistance after bending at 1 mm radius for 1,000 cycles. Finally, we demonstrate integration of an array of 25 dielets interconnected in a daisy chain configuration at 40 µm interconnect pitch.