Reel-to-Reel Copper Electroplating on Pulse Laser Deposition Coated Conductor
Reel-to-Reel Copper Electroplating on Pulse Laser Deposition Coated Conductor
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脉冲激光沉积涂层导体上的卷对卷铜电镀
DOI：
10.1109/tasc.2010.2101031
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发表时间：
2011
影响因子：
1.8
通讯作者：
A. Rutt
中科院分区：
文献类型：
--
作者：
U. Floegel;T. Riedel;D. Wippich;B. Goebel;R. Rothfeld;P. Schirrmeister;F. Werfel;A. Usoskin;A. Rutt
采用高速电镀铜技术，研究了在1 μm银帽涂层导体上可靠地制备铜稳定剂的工艺。由于在表面上20 μm厚的Cu稳定剂而获得的机械、电气和封装性能提高了实际和技术性能。基于硫酸铜CuSO 4的脉冲电镀技术能够在快速且连续的非真空工艺中存款20微米厚的铜层。环绕的Cu层保护HTS导体表面免受盐水溶液、湿气以及低温液体LN2和液氦的影响。使用铜稳定器导体，可以实现接触电阻为200 nΩ cm 2的焊接。正在进一步努力开发和建造用于长长度（> 400 m）沉积的高速率和高吞吐量连续卷对卷模块化电镀单元。本文介绍了在导体制造的实际成果。
By applying high-rate copper electroplating technique the reliable fabrication of a copper stabilizer on coated conductor with an 1 μm Ag cap is investigated. The obtained mechanical, electrical and encapsulation properties due to a 20 μm thick Cu stabilizer on the surface improve the practical and technical performance. A copper sulphate CuSO4 based pulse plating technique is capable to deposit a 20 micrometer thick copper layer in a fast and continuous non-vacuum process. A surround Cu layer protects the HTS conductor surface against salt aqueous solutions, humidity, and against cryogenic liquids LN2 and liquid helium. With the copper stabilizer conductor solder joining with a contact resistance of 200 nΩcm2 becomes possible. Further effort is being made to develop and construct a high-rate and high throughput continuous reel-to-reel modular plating unit for deposition of long length ( >; 400 m). The paper describes the practical achievements within the conductor fabrication.