Influence of Etching Mode on Enamel Bond Durability of Universal Adhesive Systems
Influence of Etching Mode on Enamel Bond Durability of Universal Adhesive Systems
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DOI：
10.2341/15-347-l
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发表时间：
2016-09-01
影响因子：
2.2
通讯作者：
Miyazaki, M.
中科院分区：
文献类型：
--
作者：
Suzuki, T.;Takamizawa, T.;Miyazaki, M.
本研究的目的是通过疲劳试验来确定三种通用粘接剂在不同酸蚀模式下的釉质粘接耐久性。使用的三种通用粘合剂是Scotchbond Universal、Prime&Bond Elect通用牙科粘合剂和All-Bond Universal光固化牙科粘合剂。使用一步自蚀刻粘合剂Clearfil S-3 Bond Plus作为对照。在全酸蚀和自酸蚀两种方式下，测定了不同酸蚀剂与牙釉质的剪切粘结强度和剪切疲劳强度。使用内径为2.4 mm的不锈钢金属环将树脂复合物粘合到平坦研磨（4000粒度）的牙齿表面，以测定SBS和SFS。对于每种釉质表面处理，SBS制备15个样本，SFS制备30个样本。然后使用用于疲劳测试的阶梯法来确定使用10-Hz频率进行50，000次循环或直到失效发生时粘结到牙釉质的树脂复合材料的SFS。扫描电子显微镜观察典型脱粘试样表面和树脂-牙釉质界面。采用双向方差分析和Tukey事后检验分析SBS数据，而采用Bonferroni校正的改良t检验分析SFS数据。所有的粘合剂在全蚀刻模式显示出显着更高的SBS和SFS值比那些在自蚀刻模式。尽管All-Bond Universal在自蚀刻模式下显示出比其他粘合剂显著更低的SBS值，但是在该模式下，粘合剂之间的SFS值没有显著差异。所有粘合剂在全蚀刻模式下比在自蚀刻模式下显示出更高的SFS：SBS比率。关于本研究中使用的粘合剂系统，通用粘合剂在全蚀刻模式下显示出更高的釉质粘结强度。尽管不同蚀刻模式对通用粘合剂的牙釉质粘合性能的影响取决于粘合剂材料，但通过疲劳测试测量，全蚀刻模式有效地提高了牙釉质粘合强度和耐久性。
The purpose of this study was to determine the enamel bond durability of three universal adhesives in different etching modes through fatigue testing. The three universal adhesives used were Scotchbond Universal, Prime&Bond Elect universal dental adhesive, and All-Bond Universal light-cured dental adhesive. A single-step self-etch adhesive, Clearfil S-3 Bond Plus was used as a control. The shear bond strength (SBS) and shear fatigue strength (SFS) to human enamel were evaluated in total-etch mode and self-etch mode. A stainless steel metal ring with an internal diameter of 2.4 mm was used to bond the resin composite to the flat-ground (4000-grit) tooth surfaces for determination of both SBS and SFS. For each enamel surface treatment, 15 specimens were prepared for SBS and 30 specimens for SFS. The staircase method for fatigue testing was then used to determine the SFS of the resin composite bonded to the enamel using 10-Hz frequencies for 50,000 cycles or until failure occurred. Scanning electron microscopy was used to observe representative debonded specimen surfaces and the resin-enamel interfaces. A two-way analysis of variance and the Tukey post hoc test were used for analysis of the SBS data, whereas a modified t-test with Bonferroni correction was used for the SFS data. All adhesives in total-etch mode showed significantly higher SBS and SFS values than those in self-etch mode. Although All-Bond Universal in self-etch mode showed a significantly lower SBS value than the other adhesives, there was no significant difference in SFS values among the adhesives in this mode. All adhesives showed higher SFS: SBS ratios in total-etch mode than in self- etch mode. With regard to the adhesive systems used in this study, universal adhesives showed higher enamel bond strengths in total-etch mode. Although the influence of different etching modes on the enamel-bonding performance of universal adhesives was found to be dependent on the adhesive material, total-etch mode effectively increased the enamel bond strength and durability, as measured by fatigue testing.