In-situ thermal monitoring informed modeling and simulation of process temperature during vat photopolymerization additive manufacturing
In-situ thermal monitoring informed modeling and simulation of process temperature during vat photopolymerization additive manufacturing
复制标题
原位热监测为光聚合增材制造过程中的工艺温度建模和仿真提供信息
DOI：
10.1016/j.matpr.2022.09.027
复制
发表时间：
2022
期刊：
影响因子：
--
通讯作者：
Zhao, Xiayun
中科院分区：
文献类型：
--
作者：
Zhang, Heyang;Zhao, Xiayun
还原光聚合 (VPP) 3D 打印是一种增材制造 (AM) 工艺，其中使用光激活聚合选择性固化液体光聚合物以创建所需的 3D 零件。由于固化反应是放热的，打印过程中会产生热量并影响树脂流变性、固化动力学和打印部件性能。了解打印过程的温度非常重要，特别是在树脂-部件界面处，温度分布可以指示转换的各向异性程度和残余应力以及其他与温度相关的特性。然而，由于夹在固体打印头和液体树脂之间的固化区域的可视性和可接近性有限，因此很难以所需的非接触方法测量打印界面。由于模型假设和未知/不确定的参数，基于模拟的现有工作的准确性有限。在这项工作中，我们展示了一个结合了原位热监测和基于有限元的模型模拟的 VPP-AM 过程温度测量方法框架。建立原位温度监测协议来校准或获取 VPP 材料系统的热性能以及测量可达到的表面温度（例如树脂室基板、构建头）。这些现场测量结果被输入到基于物理的模型中，并进行模拟以估计树脂-部件界面所需的温度分布。为了验证所开发的热监控模拟方法，我们使用特征化的自下而上热成像装置来监控单层 VPP 打印，我们的实验结果显示模拟结果与直接测量结果之间具有良好的一致性。
Vat photopolymerization (VPP) 3D printing is an additive manufacturing (AM) process in which liquid photopolymer is selectively cured using light-activated polymerization to create a desired 3D part. Since the curing reaction is exothermic, the process of printing will generate heat and affect the resin rheology, curing kinetics and printed part properties. It is important to know the temperature of the printing process, especially at the resin-part interface where the temperature distribution could indicate the anisotropic degree of conversion and residual stress among other temperature-related properties. However, it is difficult to measure the print interface in a desired non-contact approach due to the limited viewability and accessibility of the curing zone being sandwiched between solid build head and liquid resin. Existing work based on simulation has limited accuracy due to model assumptions and unknown/uncertain parameters. In this work, we demonstrate a framework of VPP-AM process temperature measurement methods that combine in-situ thermal monitoring and finite element-based model simulation. An in-situ temperature monitoring protocol is established to calibrate or obtain the thermal properties of VPP material system as well as measure the reachable surface temperature (e.g., resin chamber substrate, build head). These in-situ measurements are input to a physics-based model and simulation is conducted to estimate the desired temperature profile of the resin-part interface. To validate the developed thermal monitoring-informed simulation approach, we use a characterized bottom-up thermal imaging setup to monitor single-layer VPP printing, and our experiment result shows a good agreement between the simulation and direct measurement results.
影响因子：
56.9
作者：
Tumbleston, John R.;Shirvanyants, David;DeSimone, Joseph M.
通讯作者：
DeSimone, Joseph M.