Heat Dissipation Enhancement of 2.5D Package with 3D Graphene and 3D Boron Nitride Networks as Thermal Interface Material (TIM)
Heat Dissipation Enhancement of 2.5D Package with 3D Graphene and 3D Boron Nitride Networks as Thermal Interface Material (TIM)
复制标题
使用 3D 石墨烯和 3D 氮化硼网络作为热界面材料 (TIM) 增强 2.5D 封装的散热
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发表时间：
2016
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通讯作者：
E. Teo
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作者：
M. Loeblein;S. H. Tsang;Yong Han;Xiaowu Zhang;E. Teo
电子产品发展的主要瓶颈之一是散热。封装密度和计算能力的指数级增长导致功耗和发热量显著增加，使得新一代微处理器（即2.5D和3D电子器件）中的热管理开始对未来的发展提出挑战。这些来自器件的不需要的热点通常经由一些热界面材料（TIM）被提取到散热器。这些TIM在来自有源区的热源和安装在顶部的散热器之间建立了重要的联系。然而，传统的TIM正在迅速达到其极限，需要创新手段来克服下一代的热相关挑战。在这项工作中，我们提出了基于三维碳（3D-C）和六方氮化硼（3D-BN）的纳米结构泡沫状TIM，具有相对较高的固有热导率（~80 W/mK），并为导电和绝缘需求提供解决方案。此外，这些TIM具有超高的表面一致性，重量轻，无需回流或固化，即使在高达700°C的恶劣环境下也能保持其高性能。在2.5D测试芯片上的结果表明，这些3D泡沫状TIM具有20%的温升降低和25%的热阻降低，明显优于任何传统的TIM。
One of the major bottlenecks for the advancement in electronics is their heat dissipation. The exponential increase in packing density and computational power have resulted in a significant increase in power consumption and heat generation, such that thermal management in the new generation of microprocessor (i.e. 2.5D and 3D electronics) is starting to pose challenges in future development. These unwanted heat spots from the devices are typically extracted to the heat sink, via some thermal interface materials (TIMs). These TIMs build the important link between the heat source from the active region and the heat sink mounted on top. However, conventional TIMs are fast reaching their limits and innovative means are necessary to overcome thermal related challenges for the future generation. In this work, we present the nanostructured foam-like TIMs that are based on three-dimensional carbon (3D-C) and hexagonal boron nitride (3D-BN), with relatively high intrinsic thermal conductivities (~80 W/mK) and offer solution for both electrical conducting and insulating needs. Besides, these TIMs have ultra-high surface conformity, low weight, without the need of reflow or curing and are able to retain their high performance even at harsh environments of up to 700°C. Results on a 2.5D test chip show that these 3D foam-like TIMs have a reduction of temperature increase by 20% and of thermal resistance by 25%, significantly better than any conventional TIMs.