New method for producing power electronic circuit boards by cold-gas spraying and investigation of adhesion mechanisms
New method for producing power electronic circuit boards by cold-gas spraying and investigation of adhesion mechanisms
复制标题
冷气喷涂电力电子线路板生产新方法及附着机理研究
DOI：
10.1016/j.surfcoat.2010.06.020
复制
发表时间：
2010
影响因子：
5.4
通讯作者：
S. Kuemmel
中科院分区：
文献类型：
--
作者：
B. Wielage;T. Grund;C. Rupprecht;S. Kuemmel
用于电力电子电路或集成元件的陶瓷基板通常是通过成本密集的热过程金属化的。集成电力电子器件越来越需要简单、灵活、经济的解决方案。冷气体喷涂（CGS）可以满足这些要求。它被用来生产致密的、粘附良好的和无氧化物的涂层，其性能与相应的大块材料相当。电力电子器件非导电部件的cgs金属化允许半导体的直接组装和接触。工业上可用的al2o3基板首先用cgs涂层铝，作为粘合层。第二步，在铝层上涂上铜，铜具有良好的电性能。陶瓷上的导电结构是通过激光切割钢模板实现的，其最小电路宽度约为250μm。为了阐明冷气喷涂铝在氧化铝涂层上的粘附机理，采用扫描电镜（SEM）、扫描透射电镜（STEM）和电子背散射衍射（EBSD）对涂层样品进行了微观结构表征。
Ceramic substrates for power electronic circuits or integrated components are usually metallised by cost-intensive thermal processes. Simple, flexible and cost-effective solutions are increasingly demanded for integrated power electronic devices. Cold gas spraying (CGS) can deliver these demands. It is employed to produce dense, well adherent and oxide free coatings with properties comparable to the respective bulk material. The CGS-metallisation of non-conductive parts for power electronic devices permits a direct assembly and contacting of semi-conductors. Industrially available Al2O3substrates are first CGS-coated with aluminium, which acts as an adhesive layer. In a second step, the aluminium layer is coated with copper, which exhibits good electric properties. The conductive structure on the ceramic is achieved by using a laser cut steel template, which allows for a minimal circuit width of about 250μm. In order to clarify the adhesion mechanisms of cold-gas sprayed aluminium on alumina coated samples were subjected to micro-structural characterisation with scanning electron microscopy (SEM), scanning transmission electron microscopy (STEM) and electron backscatter diffraction (EBSD).