Improved fatigue resistance in transfer-printed flexible circuits embedded in polymer substrates with low melting temperatures
Improved fatigue resistance in transfer-printed flexible circuits embedded in polymer substrates with low melting temperatures
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DOI：
10.1088/2058-8585/acd402
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发表时间：
2023-05
影响因子：
3.1
通讯作者：
Thomas Chalklen;Michael Smith;S. Kar‐Narayan
中科院分区：
文献类型：
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作者：
Thomas Chalklen;Michael Smith;S. Kar‐Narayan
柔性电子产品由于其在从可穿戴电子产品到太阳能电池的一系列领域中的应用而引起极大的兴趣和重要性。虽然近年来印刷柔性电子器件的分辨率一直在提高，但仍然存在机械疲劳和基板成本的问题，限制了这种器件的使用并导致成本增加和废品。在这里，我们提出了一种新的方法，用于提高印刷的柔性电子产品的抗疲劳性的一个因素的40%，通过烧结的电子之前，将它们转移到低成本的聚合物基板，使它们保持嵌入。该方法使用气溶胶喷射打印机使用银纳米颗粒油墨印刷的电路来证明，并且可以适用于多种不同的金属油墨。同时，该方法可用于将印刷电路转移到具有低熔融温度的聚合物中，而不需要油墨固化所需的其他有害的高烧结温度。
Flexible electronics are of great interest and importance due to their applications in a range of fields, from wearable electronics to solar cells. Whilst resolutions of printed flexible electronics have been improving in recent years, there remain problems with mechanical fatigue and substrate cost, curtailing the use of such devices and resulting in increased cost and waste products. Here we present a novel method for improving the fatigue resistance of printed flexible electronics by a factor of ∼40 by sintering the electronics prior to transferring them into low-cost polymer substrates, such that they remain embedded. This method is demonstrated using circuits printed using silver nanoparticulate ink with an aerosol jet printer, and could be applicable to multiple different metallic inks. At the same time, this method can be used to transfer print circuits into polymers with low melting temperatures, without the need for otherwise detrimentally high sintering temperatures required for ink curing.