A percolative approach to investigate electromigration failure in printed Ag structures
A percolative approach to investigate electromigration failure in printed Ag structures
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DOI：
10.1063/1.4963755
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发表时间：
2016-09
影响因子：
3.2
通讯作者：
Zhao Zhao-Zhao;Avinash Mamidanna;Christopher S. Lefky;O. Hildreth;T. Alford
中科院分区：
文献类型：
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作者：
Zhao Zhao-Zhao;Avinash Mamidanna;Christopher S. Lefky;O. Hildreth;T. Alford
印刷微电子产品的易于制造和广泛应用正在推动反应性油墨的发展。使用反应性油墨印刷的结构的长期性能对于它们在微电子中的应用是重要的。在这项研究中，银线印刷低温，自还原，银-二胺基油墨。首先利用Black方程研究了印刷银的电迁移失效。然而，由于印刷的Ag线的多孔性质，Black方程不是预测寿命的最佳拟合，这是因为Black方程没有考虑形态诱导的电流拥挤。我们发现，印刷的Ag线的电阻率可以描述（作为空隙率的函数）由逾渗理论。此外，我们还表明，印刷银的故障寿命可以预测相当不错的故障模型。
The ease of fabrication and wide application of printed microelectronics are driving advances in reactive inks. The long-term performance of structures printed using reactive ink is important for their application in microelectronics. In this study, silver lines are printed with low-temperature, self-reducing, silver-diamine based ink. The electromigration failure of the printed silver is first studied using Black's equation. However, due to the porous nature of the printed Ag line, Black's equation is not the best fit for predicting the lifetime, this is because Black's equation does not take into account morphology-induced current crowding. We find that the resistivity of the printed Ag lines can be described (as a function of void fraction) by percolation theory. In addition, we also demonstrate that the failure lifetimes of the printed Ag can be predicted quite well by a percolative model of failure.