A novel layout decomposition algorithm for triple patterning lithography

A novel layout decomposition algorithm for triple patterning lithography
复制标题

DOI:
10.1145/2228360.2228579
复制
发表时间:
2012-06
期刊:
DAC Design Automation Conference 2012
影响因子:
--
通讯作者:
Shao-Yun Fang;Yao-Wen Chang;Wei-Yu Chen
Shao-Yun Fang;Yao-Wen Chang;Wei-Yu Chen
中科院分区:
其他
文献类型:
--
作者:
Shao-Yun Fang;Yao-Wen Chang;Wei-Yu Chen

文献摘要

被引文献

相似文献

虽然双图案化光刻(DPL)已被广泛认为是用于亚22 nm技术节点以增强图案可印刷性的最有前途的解决方案之一,但是对于15 nm技术节点及更高,对于栅极、接触和金属-1层将需要三图案化光刻(TPL),这些层太复杂且太密集而不能被分成仅两个掩模。然而,目前对第三方物流布局分解的研究还很少。最近的工作[16]提出了第三方物流布局分解的第一个系统的研究。然而,所提出的算法扩展了DPL中使用的针脚查找方法,可能会错过法律的针脚位置并产生冲突,这些冲突可以通过为TPL插入针脚来解决。在本文中,我们指出了两个主要区别DPL和TPL布局分解。基于这两个差异,我们提出了一种新的第三方物流布局分解算法。首先,我们提出了两个新的图形减少技术,以减少问题的大小,而不会降低整体解决方案的质量。然后,我们提出了一种基于启发式的掩模分配算法,该算法发现了一个掩模分配,使得同一掩模中的特征之间的冲突更有可能通过插入针脚来解决。最后,缝合是为了解决尽可能多的冲突。实验结果表明,与已有算法相比,该算法能有效地减少布局冲突约56%,加速40倍以上。
While double patterning lithography (DPL) has been widely recognized as one of the most promising solutions for the sub-22nm technology node to enhance pattern printability, triple patterning lithography (TPL) will be required for gate, contact, and metal-1 layers which are too complex and dense to be split into only two masks, for the 15nm technology node and beyond. Nevertheless, there is very little research focusing on the layout decomposition for TPL. The recent work [16] proposed the first systematic study on the layout decomposition for TPL. However, the proposed algorithm extending a stitch-finding method used in DPL may miss legal stitch locations and generate conflicts that can be resolved by inserting stitches for TPL. In this paper, we point out two main differences between DPL and TPL layout decompositions. Based on the two differences, we propose a novel TPL layout decomposition algorithm. We first present two new graph reduction techniques to reduce the problem size without degrading overall solution quality. We then propose a stitch-aware mask assignment algorithm, based on a heuristic that finds a mask assignment such that the conflicts among the features in the same mask are more likely to be resolved by inserting stitches. Finally, stitches are inserted to resolve as many conflicts as possible. Experimental results show that the proposed layout decomposition algorithm can achieve around 56% reduction of conflicts and more than 40X speed-up compared to the previous work.