Auger Parameter Analysis of Ag and Cu Nanoparticles Formed by Sputter Deposition on Non-conductive Substrates
Auger Parameter Analysis of Ag and Cu Nanoparticles Formed by Sputter Deposition on Non-conductive Substrates
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非导电基底上溅射沉积形成的银和铜纳米粒子的俄歇参数分析
DOI:
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发表时间:
2008
期刊:
影响因子:
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通讯作者:
H. Naramoto
中科院分区:
文献类型:
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作者:
Y. Minakuchi;K. Takahiro;F. Nishiyama;S. Yamamoto;K. Narumi;H. Naramoto