Estimation of Liquidus Temperature of Sn Based Alloys and Its Application to the Design of Pb-Free Solder

Estimation of Liquidus Temperature of Sn Based Alloys and Its Application to the Design of Pb-Free Solder
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锡基合金液相线温度的估算及其在无铅焊料设计中的应用

DOI:
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发表时间:
2002
期刊:
Journal of Materials Science : Materials in Electronics Vol.13
影响因子:
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通讯作者:
H.Ezaki et al.
H.Ezaki et al.
中科院分区:
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文献类型:
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作者:
M.Isshiki;et al.;Sang-Pil Lee;H.Ezaki et al.

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