Modeling of micro-crack growth during thermal shock based on microstructural images of thermal barrier coatings
Modeling of micro-crack growth during thermal shock based on microstructural images of thermal barrier coatings
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DOI：
10.1016/j.commatsci.2009.03.039
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发表时间：
2009-09
影响因子：
3.3
通讯作者：
Shen Wei;Fan Qunbo;Wang Fu-chi;M. Zhuang
中科院分区：
文献类型：
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作者：
Shen Wei;Fan Qunbo;Wang Fu-chi;M. Zhuang
基于数字图像处理理论和有限元网格生成原理，提出了一种借助有限元程序模拟热障涂层热冲击过程中微裂纹扩展的方法。首先将等离子喷涂TBC的微观结构图像转换为数字图像;其次，根据实际微观结构通过阈值分割生成有限元网格模型;最后，在有限元网格模型的基础上，采用Tuler-Butcher失效准则对热冲击过程中TBC的微裂纹扩展进行建模。数值模拟结果与实验结果吻合较好，本文提出的方法是有效的微裂纹扩展模型。
Based on digital image processing theory and finite element mesh generation principle, a methodology is proposed to model the micro-crack growth of thermal barrier coatings (TBCs) during thermal shock with the aid of finite element program. Firstly, a microstructural image of plasma sprayed TBCs is transferred to digital image; secondly, a finite element grid model is generated by thresholding segmentation according to the actual microstructure; finally, based on the finite element grid model, the Tuler–Butcher failure criterion is employed to model the micro-crack growth of TBCs during thermal shock. The numerical simulation result agrees well with the experimental result, and the methodology presented in this paper is found to be effective to model the micro-crack growth.