A new dynamic recrystallisation model of an extruded Al-Cu-Li alloy during high-temperature deformation
A new dynamic recrystallisation model of an extruded Al-Cu-Li alloy during high-temperature deformation
复制标题
挤压Al-Cu-Li合金高温变形过程中新的动态再结晶模型
DOI：
10.1016/j.msea.2014.11.095
复制
发表时间：
2015-02-11
期刊：
影响因子：
6.4
通讯作者：
Wang, Xinyun
中科院分区：
文献类型：
--
作者：
Shen, Bo;Deng, Lei;Wang, Xinyun
通过在不同温度（613、673和733 K）、不同应变速率（0.001、0.01和0.1 s(-1)）下的压缩试验，研究了挤压铝铜锂合金的高温变形行为和显微组织演变。结果表明：随着应变从0.1增加到0.7，变形激活能从208.7 kJ/mol增加到255.7 kJ/mol；电子后向散射衍射图表明，在高温变形过程中发生了动态再结晶。两种类型的再结晶机制，即晶界胀形和晶界从低错取向到高错取向的转变，被认为是控制再结晶晶粒形成的机制。提出了一种包含这两种机制的动态再结晶模型来描述挤压铝铜锂合金的微观组织演变。在变形初期，晶界沿原晶界胀形形成再结晶晶粒。随着应变的增加，变形晶粒由低角晶界向高角晶界转变，逐渐产生再结晶晶粒。(C) 2014 Elsevier B.V.版权所有
The high-temperature deformation behaviour and microstructure evolution of an extruded Al-Cu-Li alloy were investigated by compression tests conducted at various temperatures (613, 673 and 733 K) with various strain rates (0.001, 0.01, and 0.1 s(-1)). The results indicated that the deformation activation energy increased from 208.7 kJ/mol to 255.7 kJ/mol with an increase in strain from 0.1 to 0.7. The electron backscatter diffraction maps indicated that a dynamic recrystallisation occurred during the high-temperature deformation. Two types of recrystallisation mechanisms, grain boundary bulging and a grain boundary transformation from low misorientation to high misorientation, were considered as the mechanisms for controlling the formation of the recrystallised grains. A new dynamic recrystallisation model containing these two mechanisms was proposed to describe the microstructure evolution of the extruded Al-Cu-Li alloy. At the early stage of the deformation, the recrystallised grains were formed by grain boundary bulging along the original grain boundaries. With increasing strain, recrystallised grains were gradually generated in the deformed grains due to the transformation from low angle boundaries to high angle boundaries. (C) 2014 Elsevier B.V. All rights reserved.