Ultrasonic wire-bond quality monitoring using piezoelectric sensor
Ultrasonic wire-bond quality monitoring using piezoelectric sensor
复制标题
DOI：
10.1016/s0924-4247(97)01638-5
复制
发表时间：
1998-02-15
影响因子：
4.6
通讯作者：
Yuen, CWM
中科院分区：
文献类型：
--
作者：
Or, SW;Chan, HLW;Yuen, CWM
本文介绍了一种超声线-键合质量监测技术，该技术通过监测超声线-键合换能器系统的超声振动变化来检测键合过程中键合区机械阻抗的变化。采用与商用PZT- 5a具有相似性能的锆钛酸铅（PZT）压电陶瓷作为传感器材料。在换能器上的适当位置安装PZT压电传感器，以测量粘接过程中的超声波振幅和粘接时间。该传感器的尺寸为1mm X 1mm X 0.245 mm，以避免传感器上的过度负载，并获得平坦的频率响应。研制了一种bond质量监测系统，对传感器检测到的非线性信号进行处理和记录。在超声信号的高频谐波（二次谐波）处观察到更显著的变化。发现二次谐波的变化与键的质量有很好的相关性。可识别粘接过程中粘接质量向不可接受方向漂移。该技术将用于开发一种基于多参数的线键合自动过程控制系统。(C) 1998 Elsevier Science S.A.
This paper describes an ultrasonic wire-bond quality monitoring technique which involves the detection of changes in the mechanical impedance of the bond zone during bond formation by monitoring the changes in the ultrasonic vibrations of an ultrasonic wire-bonding transducer system. A lead zirconate titanate (PZT) piezoelectric ceramic having properties similar to the commercial PZT-5A has been selected as the sensor material. A PZT piezoelectric sensor is installed on an appropriate location on the transducer in order to measure the ultrasonic amplitude and bonding time during the bonding process. This sensor has dimensions 1 mm X 1 mm X 0.245 mm to avoid excessive loading on the transducer and to obtain a flat frequency response. A bond quality monitoring system has been developed to process and record the non-linear signal detected by the sensor. More significant changes are observed at the higher-frequency harmonics (second harmonic) of the ultrasonic signal. Good correlation is found between the change in the second harmonic and the bond quality. Bonding process drift towards unacceptable bond quality can be identified. This technique will be used to develop a multiparameter-based automatic process-control system for wire bonding. (C) 1998 Elsevier Science S.A.