pH modification for silica control
pH modification for silica control
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调节 pH 值以控制二氧化硅
DOI：
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发表时间：
2013
期刊：
影响因子：
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通讯作者：
H. L. Anderson
中科院分区：
文献类型：
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作者：
P. Brady;S. J. Altman;L. K. McGrath;J. Krumhansl;H. L. Anderson
降低溶液的pH值可以减缓二氧化硅的聚合和二氧化硅垢的形成。在间歇系统中，降低约200 ppm二氧化硅溶液的pH值可防止结垢超过300小时。二氧化硅垢在接近pH 8时形成最快。pH值为3.6-3.7的溶液可在约90小时内保持1，000 - 3，000 ppm的二氧化硅水平。实验室规模的膜测试表明，在将pH值降低至4.5-4.7后，二氧化硅污垢形成的滞后时间约为72小时，这可能允许在水处理过程中发生污垢形成之前通过例如逆流来冲洗含二氧化硅的溶液。
ABSTRACT Lowering solution pH slows the polymerization of silica and formation of silica scale. In batch systems, lowering the pH of approximately 200 ppm silica solutions prevents scale formation for over 300 h. Silica scale forms most quickly near pH 8. Solutions with pH 3.6–3.7 can maintain silica levels of 1,000–3,000 ppm for roughly 90 h. Bench-scale membrane testing showed that silica scale formation lag times of approximately 72 h were achievable after lowering the pH to 4.5–4.7, which might allow flushing of silica-laden solutions through, for example, flow reversal, before scale formation occurs during water treatment.