Influence of negative bias voltage on microstructure and property of Al-Ti-N films deposited by multi-arc ion plating

Influence of negative bias voltage on microstructure and property of Al-Ti-N films deposited by multi-arc ion plating
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DOI:
10.1016/j.ceramint.2016.12.019
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发表时间:
2017-03
影响因子:
5.2
通讯作者:
F. Cai;C. Mohan;Ming-xi Li;Shihong Zhang
F. Cai;C. Mohan;Ming-xi Li;Shihong Zhang
中科院分区:
材料科学1区
文献类型:
--
作者:
F. Cai;C. Mohan;Ming-xi Li;Shihong Zhang

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在本研究中,我们系统地研究了负偏压对多弧离子镀(MAIP) AlTiN薄膜的组成、沉积效率、微观结构和力学性能的影响。在不同的负偏置电压下,用map在高速钢衬底上沉积薄膜。结果表明,负偏置电压对Al含量[Al/(Al+Ti)比]和沉积效率有显著影响。x射线光电子能谱分析表明,AlTiN薄膜由Ti-N和Al-N键组成。随着负偏压的增加,膜表面的大颗粒(MPs)减少。我们还讨论了在薄膜上发现的不同类型的MPs及其对薄膜硬度测定过程的影响。薄膜的显微硬度取决于负偏置电压。在−250 V下沉积的膜的最大硬度为~45 GPa。黏附和摩擦试验结果表明,在−150 V下沉积的膜具有最高的抗裂性能,临界载荷为78 N时的黏附性能最佳,黏附强度最高,摩擦系数最低且最稳定,为0.23。
In this study, we systematically investigated the effects of negative bias voltage on the composition, deposition efficiency, microstructure, and mechanical properties of multi-arc ion plated (MAIP) AlTiN films. The films were deposited on high-speed steel substrates by MAIP at various negative bias voltages. The results indicated that the Al content [Al/(Al+Ti)ratio] and the deposition efficiency were significantly altered by the application of negative bias voltages. X-ray photoelectron spectroscopy analysis showed that the AlTiN films were composed of Ti–N and Al–N bonds. The macroparticles (MPs) on the film surface decreased with increasing negative bias voltage. We also discussed the different types of MPs found on the films and their influence on the process of determining the hardness of the films. The microhardness of the films depends on the negative bias voltages. The films deposited at −250 V exhibited a maximum hardness of ~45 GPa. The adhesion and frictional tests revealed that the film deposited at −150 V demonstrated the highest cracking resistance, the best adhesion under a critical load of 78 N, highest adhesion strength, and the lowest and stablest coefficient of friction at 0.23.